SatixFy Showcases Next-Gen Space Chip Technology
by Sophie Jenkins
London, UK (SPX) Mar 15, 2024

SatixFy Communications Ltd. (NYSE AMERICAN: SATX), a pioneering force in satellite communication technologies, has moved its Prime 2.0 Digital Beamformer (DBF) chip and Sx4000 Digital Payload On-Board-Processing Chip for Digital Satellite Payload into the advanced customer sampling phase. These innovations are now being evaluated by manufacturers of satellites in both low earth orbit (LEO) and geostationary orbit (GEO).

The Sx4000, integral for digital payload processing, is undergoing final irradiation tests to confirm its readiness for space. It is anticipated to be flight-ready by the latter half of 2024.

Nir Barkan, the Acting CEO of SatixFy, expressed optimism about the company's trajectory, stating, "Our progress with the Sx4000 and Prime 2.0 chips underscores our commitment to leading in next-generation satellite communication systems. These chips are fundamental to the development of advanced satellite payloads, and we are excited about their market potential and our technology's future."

In a demonstration of its technological advancements, SatixFy will present its latest space chips at the upcoming Satellite Show in Washington D.C., from March 19-21, 2024.

The Sx4000 Chip, designed for NGSO and GSO satellites, represents a leap in space-grade regenerative chip technology, supporting DVB-S2X and RCS2 standards and accommodating Gateway multichannel receivers.

Similarly, the Prime 2.0 Chip is at the forefront of satellite antenna technology, enabling the construction of Electrically Steered Multibeam Antennas (ESMA) that can scale up to 10,000 elements, offering unprecedented flexibility and performance.

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