Samsung said the new MCP solution offered a combined capacity of 3.2 gigabits in a package only 1.4mm thick, promising a new generation of cell phones and mobile devices offering more services and faster Internet surfing.

"The new eight-chip MCP is an extremely compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications," Samsung said in a statement.

"It will provide much greater functionality in cellphones and other smart mobile devices, from movie videos to games as well as faster Internet access."

Samsung said the new MCP offered all the memory chips available for mobile products in a single 11mm x 14mm x 1.4mm package.

In a separate announcement, Samsung said it would invest 603.8 billion won (570 million dollars) to increase capacity at its 12-inch memory plant and another 393.7 billion to upgrade existing facilities.

The investment is aimed at meeting rising demand for dynamic random access memory chips in electronic devices.

Samsung has earmarked nearly six trillion won for its semiconductor operations for 2005.

The company said it would elaborate on this year's investment plan on Friday, when it announces its fourth-quarter earnings.

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