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TOKYO (AFP) Dec 22, 2004 Japan's Shin-Etsu Handotai Co., the world's leading silicon wafer maker, plans to more than double production capacity for 300mm wafers, a report said Wednesday. The company plans to invest a total of at least 200 billion yenbillion dollars) in Japan and the United States to raise its combined monthly 300mm wafer production capacity in the two countries to 700,000 units in a few years, the Nihon Keizai Shimbun said. It will be the firm's biggest capital investment, with the hope of capturing half of the global market for 300mm wafers, from the current share of 30 percent, it said. Officials at Shin-Etsu Handotai declined to immediately comment on the report. Under the plan, Shin-Etsu Handotai will become the first Japanese company with 300mm wafer production operations overseas, the Nihon Keizai said. All rights reserved. copyright 2018 Agence France-Presse. Sections of the information displayed on this page (dispatches, photographs, logos) are protected by intellectual property rights owned by Agence France-Presse. As a consequence, you may not copy, reproduce, modify, transmit, publish, display or in any way commercially exploit any of the content of this section without the prior written consent of Agence France-Presse.
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