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TECH SPACE
Raytheon Delivers US Navy's First Dual-Frequency Sonar
by Staff Writers
National Harbor, MD (SPX) Apr 17, 2012


File image: DDG 1000 destroyer.

Raytheon has completed delivery of the electronics for the AN/SQQ-90 tactical sonar suite, the complex sonar for the first ship of the U.S. Navy's DDG 1000-class multimission destroyer.

The AN/SQQ-90 tactical sonar suite, the first dual-frequency hull-mounted sonar of the Navy's surface fleet, is a major advancement in undersea warfare capability and will provide broad warfighting coverage to DDG 1000.

Raytheon delivered the sonar electronics completely assembled and integrated into an Electronic Modular Enclosure (EME), an innovation to 21st century shipbuilding designed into the Zumwalt-class destroyer program for affordability.

The EME delivers benefits not only in upfront integration and testing before delivery to the shipyard for ship installation, but also minimizes the footprint occupied onboard the ship (size and weight) and maximizes efficiencies in both power and cooling.

The AN/SQQ-90 comprises the AN/SQS-60 hull-mounted mid-frequency sonar; the AN/SQS-61 hull-mounted high-frequency sonar; and the AN/SQR-20 multi-function towed array sonar and handling system.

Raytheon is the AN/SQQ-90 systems integrator, bringing together the full functionality of the suite's sonar system elements. Through automation and unique information management, DDG 1000's AN/SQQ-90 can be operated by one-third the crew of current Aegis platforms.

"The AN/SQQ-90 is, without a doubt, the most advanced integrated undersea warfare system in the world," said Kevin Peppe, vice president of Seapower Capability Systems for Raytheon's Integrated Defense Systems business.

"Integrated with DDG 1000's open architecture combat system and multi-sensor capabilities, AN/SQQ-90 will provide superior operational performance in both the littorals and deep waters against a multitude of targets, including mines and quiet diesel submarines."

Innovation in Ship Systems Integration
EMEs are large subsystem assemblies that efficiently package the shock mitigation, electromagnetic interference protection, thermal conditioning, security and vibration isolation for commercial off-the-shelf electronics integrated inside.

The sonar electronics EME contains the fully assembled, integrated and tested electronics to power and control the ship's hull-mounted sonar, including the transmit/receive amplifiers and associated processors that distribute signals and data to the ship's command center.

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