This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251020459437/en/

YES VertaCure, VertaPrime, VeroFlex, TersOra, and SURE systems.

The systems will be deployed in advanced packaging lines dedicated to hyperscale AI workloads, including training, inference, networking, and co-packaged optics. This award marks a significant milestone in the industry's shift toward glass-based 2.5D and 3D packaging as system performance, density, and thermal requirements escalate.

YES will supply a full suite of solutions for the customer's panel-level process flow, including:

-- VertaCure?: Fully automated vacuum curing systems providing complete solvent removal, uniform heating, and superior particle performance.

-- VertaPrime?: Low-vacuum vapor deposition systems for optimized adhesion and process readiness.

-- VeroFlex?FAR: Precision panel-level reflow systems enabling uniform temperature ramping for interconnect formation.

-- TersOra?: Advanced edge-zone removal platforms for precise and clean edge definition.

-- SURE? Wet Process Platform: High-performance wet etch and clean systems tailored for large-panel applications.

"We're excited to deliver a comprehensive suite of glass-panel tools that support the transition to high-throughput, panel-level packaging for AI and HPC," said Rezwan Lateef, President of YES. "Our equipment has already been proven in high-volume manufacturing lines at tier-one IDMs and foundries. With the industry's shift toward larger substrates and co-packaged optics solutions, YES is uniquely positioned as a trusted partner across both wafer and panel-based ecosystems."

YC Wong, VP of Sales and Business Development at YES Singapore, added, "Glass is becoming the substrate of choice for next-gen 2.5D and 3D packages due to its dimensional stability and electrical performance. Our presence in Singapore and deep experience in volume manufacturing allows us to closely support our customers as they transition from wafer to panel formats."

This order reinforces YES's leadership in panel-level packaging technologies, addressing critical challenges in curing, cleaning, reflow, and deposition for glass-based substrates. As demand for AI infrastructure accelerates, YES remains at the forefront of enabling the industry's next wave of advanced packaging innovation.

About YES

YES is a leading provider of differentiated technologies for materials and interface engineering needed for a wide range of applications and markets. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems, and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company's products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via and Cavity Etch, and Electroless Deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit YES.tech.

View source version on businesswire.com: https://www.businesswire.com/news/home/20251020459437/en/

Contact

Media contact:Alex [email protected]

© 2025 Business Wire, Inc.Disclaimer:This press release is not a document produced by AFP. AFP shall not bear responsibility for its content. In case you have any questions about this press release, please refer to the contact person/entity mentioned in the text of the press release.