. 24/7 Space News .
CHIP TECH
New insulation technique paves the way for more powerful and smaller chips
by Staff Writers
Leuven, Belgium (SPX) Sep 05, 2019

Seamless filling of nanoscale trenches with a porous metal-organic framework enabled by solvent-free conversion of a dense metal oxide film.

Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips. The technique uses metal-organic frameworks, a new type of materials consisting of structured nanopores. In the long term, this method can be used for the development of even smaller and more powerful chips that consume less energy. The team has received an ERC Proof of Concept grant to further their research.

Computer chips are getting increasingly smaller. That's not new: Gordon Moore, one of the founders of chip manufacturer Intel, already predicted it in 1965. Moore's law states that the number of transistors in a chip, or integrated circuit, doubles about every two years. This prognosis was later adjusted to 18 months, but the theory still stands. Chips are getting smaller and their processing power is increasing. Nowadays, a chip can have over a billion transistors.

But this continued reduction in size also brings with it a number of obstacles. The switches and wires are packed together so tightly that they generate more resistance. This, in turn, causes the chip to consume more energy to send signals. To have a well-functioning chip, you need an insulating substance that separates the wires from each other, and ensures that the electrical signals are not disrupted. However, that's not an easy thing to achieve at the nanoscale level.

Nanoporous crystals
A study led by KU Leuven professor Rob Ameloot (Department of Microbial and Molecular systems) shows that a new technique might provide the solution. "We're using metal-organic frameworks (MOFs) as the insulating substance. These are materials that consist of metal ions and organic molecules. Together, they form a crystal that is porous yet sturdy."

For the first time, a research team at KU Leuven and imec managed to apply the MOF insulation to electronic material. An industrial method called chemical vapour deposition was used for this, says postdoctoral researcher Mikhail Krishtab (Department of Microbial and Molecular systems). "First, we place an oxide film on the surface. Then, we let it react with vapour of the organic material. This reaction causes the material to expand, forming the nanoporous crystals."

"The main advantage of this method is that it's bottom-up," says Krishtab. "We first deposit an oxide film, which then swells up to a very porous MOF material. You can compare it to a souffle; that puffs up in the oven and becomes very light. The MOF material forms a porous structure that fills all the gaps between the conductors. That's how we know the insulation is complete and homogeneous. With other, top-down methods, there's always still the risk of small gaps in the insulation."

Powerful and energy efficient
Professor Ameloot's research group has received an ERC Proof of Concept grant to further develop the technique, in collaboration with Silvia Armini from imec's team working on advanced dielectric materials for nanochips. "At imec, we have the expertise to develop wafer-based solutions, scaling technologies from lab to fab and paving the way to realising a manufacturable solution for the microelectronics industry."

"We've shown that the MOF material has the right properties," Ameloot continues. "Now, we just have to refine the finishing. The surface of the crystals is still irregular at the moment. We have to smoothen this to integrate the material in a chip."

Once the technique has been perfected, it can be used to create powerful, small chips that consume less energy. Ameloot: "Various AI applications require a lot of processing power. Think of self-driving cars and smart cities. Technology companies are constantly looking for new solutions that are both quick and energy efficient. Our research can be a valuable contribution to a new generation of chips."

Research paper


Related Links
KU Leuven
Computer Chip Architecture, Technology and Manufacture
Nano Technology News From SpaceMart.com


Thanks for being there;
We need your help. The SpaceDaily news network continues to grow but revenues have never been harder to maintain.

With the rise of Ad Blockers, and Facebook - our traditional revenue sources via quality network advertising continues to decline. And unlike so many other news sites, we don't have a paywall - with those annoying usernames and passwords.

Our news coverage takes time and effort to publish 365 days a year.

If you find our news sites informative and useful then please consider becoming a regular supporter or for now make a one off contribution.
SpaceDaily Monthly Supporter
$5+ Billed Monthly


paypal only
SpaceDaily Contributor
$5 Billed Once


credit card or paypal


CHIP TECH
Swedish researchers unveil world's smallest accelerometer
Washington (UPI) Sep 3, 2019
Engineers in Sweden have developed the world's smallest accelerometer using graphene. The accelerometer could be used to create new wearable technologies for use in medicine, fitness and gaming. "Based on the surveys and comparisons we have made, we can say that this is the smallest reported electromechanical accelerometer in the world," Xuge Fan, a researcher at the KTH Royal Institute of Technology, said in a news release. "We can scale down components because of the material's atomic- ... read more

Comment using your Disqus, Facebook, Google or Twitter login.



Share this article via these popular social media networks
del.icio.usdel.icio.us DiggDigg RedditReddit GoogleGoogle

CHIP TECH
China's satellite tests pulsar navigation for future deep space exploration

India not poor, has resources for space program says ISRO chief

Spacecraft carrying Russian humanoid robot docks at ISS

Vegetable cultivation in the Antarctic for the Moon and Mars

CHIP TECH
China's first medium-scale launcher with LOX LCH4 propellants ZQ-2 soliciting payloads worldwide

New Delhi in Talks With Moscow Over Rocket Engines for Indian Space Program

'Game-Changer' for Cosmic Research: NASA Chief Touts Nuclear Powered Spacecraft

Scientific Samples Make the Journey Back to Earth aboard SpaceX's Dragon

CHIP TECH
NASA engineers attach Mars Helicopter to Mars 2020 rover

NASA Invites Students to Name Next Mars Rover

NASA's Mars Helicopter Attached to Mars 2020 Rover

ExoMars rover ready for environment testing

CHIP TECH
China's newly launched communication satellite suffers abnormality

China launches first private rocket capable of carrying satellites

Chinese scientists say goodbye to Tiangong-2

China's space lab Tiangong 2 destroyed in controlled fall to earth

CHIP TECH
ESA and GomSpace Luxembourg sign contract for continued constellation management development

New Iridium Certus transceiver for faster satellite data now in live testing

KLEOS Space funding will start procurement of 2nd cluster of satellites

ThinKom Solutions Unveils New Multi-Beam Reconfigurable Phased-Array Gateway Solution for Next-Generation Satellites

CHIP TECH
In praise of the big pixel: Gaming is having a retro moment

FEFU scientists developed brand-new rapid strength eco-concrete

Smarter experiments for faster materials discovery

Defrosting surfaces in seconds

CHIP TECH
Exoplanets Can't Hide Their Secrets from Innovative New Instrument

Hints of a volcanically active exomoon

Canadian astronomers determine Earth's fingerprint

The dark side of extrasolar planets share surprisingly similar temperatures

CHIP TECH
ALMA shows what's inside Jupiter's storms

Young Jupiter was smacked head-on by massive newborn planet

Mission to Jupiter's icy moon confirmed

Giant Impact Disrupted Jupiter's Core









The content herein, unless otherwise known to be public domain, are Copyright 1995-2024 - Space Media Network. All websites are published in Australia and are solely subject to Australian law and governed by Fair Use principals for news reporting and research purposes. AFP, UPI and IANS news wire stories are copyright Agence France-Presse, United Press International and Indo-Asia News Service. ESA news reports are copyright European Space Agency. All NASA sourced material is public domain. Additional copyrights may apply in whole or part to other bona fide parties. All articles labeled "by Staff Writers" include reports supplied to Space Media Network by industry news wires, PR agencies, corporate press officers and the like. Such articles are individually curated and edited by Space Media Network staff on the basis of the report's information value to our industry and professional readership. Advertising does not imply endorsement, agreement or approval of any opinions, statements or information provided by Space Media Network on any Web page published or hosted by Space Media Network. General Data Protection Regulation (GDPR) Statement Our advertisers use various cookies and the like to deliver the best ad banner available at one time. All network advertising suppliers have GDPR policies (Legitimate Interest) that conform with EU regulations for data collection. By using our websites you consent to cookie based advertising. If you do not agree with this then you must stop using the websites from May 25, 2018. Privacy Statement. Additional information can be found here at About Us.